Exhibition

Nine cities working together to build a new ecosystem for test interconnection

Amid the wave of independent technological innovation, Tengfang Zhongke, with its core technologies and solutions, deeply participated in the "2025 Full-Chain Modular Test Instrument Conference", completing a tour exhibition journey spanning nine cities including Beijing, Shanghai, Wuhan, Nanjing, Harbin, Changchun, Shenyang, Xi 'an and Chengdu. This industry event, which lasted for several months, not only served as a concentrated display of Tengfang Zhongke's technological strength but also became an important bridge for responding to the industrial demands of various regions and deepening the cooperation among industry, academia and research.

As a national high-tech enterprise, Tengfang Zhongke showcased its full range of signal adaptation solutions during the exhibition tour From the VH6 series universal test connection solution that supports 1,200 to 3,500 signal points, to the CMW series 1000A high-current connector that can achieve a 100,000-cycle insertion and extraction life, and then to the V25 series high-density interconnection platform that is compatible with multiple brand cases, it fully demonstrates the core value of "making connections simpler".