• Accuracy: < 0.1% F.S. • Excitation Voltage: 5 - 15 V DC • Full-Scale Deflection: < 0.3 mm • Selectable Range: 0.1 - 20 kN • Technology: Silicon Piezoresistive • Housing: Stainless Steel
- 304 stainless steel monolithic housing - Amplitude-frequency response up to 10,000 Hz - 10,000g shock resistance on any axis - Selectable measurement range: ±50g to ±500g - MEMS variable capacitance technology - Lightweight: 15g
Accuracy: ±0.02% span over the temperature range Response Time: 300 milliseconds or less Long-term Stability: ±100 ppm FS/year Measurement Range: 0-20 MPa (selectable) Sensing Technology: Silicon resonant sensor Overpressure Tolerance: 1.5 times the full-scale pressure
128-cross-point, 2-wire PXIe high-density switch matrix module
Product Overview
Key Features
128 cross points
2-wire 4x32, 2-wire 8x16, 2-wire two-group 4x16 matrix
High density
Relay operation count
10MHz effective bandwidth
Supports operating systems such as Windows and Linux
VISA-based DLL driver for secondary development
Application Scenarios
The multiplexer is an integral component of integrated circuit testing since it represents the channel switching primary source that is very close to integrated circuit performance verification.
The multiplexer finds great application in wafer-level testing by acting as a link that helps to reduce the time of connection between test equipments and wafer test points. Such a feature naturally paves the way for wafer-level verification tasks.
The multiplexer fits like a glove to semiconductor automatic test equipment (ATE), where it serves as the chief usage channel of the main channel module in semiconductor automatic test equipment (ATE) systems.
Multiplexers are indispensable contributors in electronic product’s electrical performance testing and thus one of the most important methods for electronic product electrical parameter measurement through stable channel control.
The multiplexer above promises to deliver both core and non-core application scenarios due to its channel management capability, which is high enough to meet the various demands of different electronic testing fields.
Parameters
Basic Specifications | |||
Channel Scale | 2-wire 4x32 matrix / 2-wire 8x16 matrix / 2-wire two-group 4x16 matrix | ||
Operating Temperature | 0℃ ~ +55℃ | Overall Dimensions | 3U |
Storage Temperature | -22℃ ~ +70℃ | Bus Type | PXIe |
General Characteristics | |||
Maximum Switching Voltage | 150VDC | Maximum Switching Curren | 1A |
Maximum Switching Power | 30W | Maximum Load Current per Channe | 2A |
Open-Circuit Resistance | >1×10⁹Ω | Thermoelectric EMF | < 9 μV |
Maximum Operating Frequency | 10MHz | On-Resistance | initial：<0.7Ω |
Relay Operation Time | maximum value: 4ms | end-of-life：≥1.0Ω | |
Crosstalk Between Channels | ||
10kHz ≤ -80dB | 100kHz ≤ -65dB | 1MHz ≤ -50dB |
Topology Diagram
Customization
The TF85190 switch matrix series products are both functionally and aesthetically customizable, allowing for complete transformation to meet various application needs. Each customized TF85190 switch matrix product is assigned a unique model number, making it easy for users to order customized versions of the TF85190 switch matrix series at any time.
FAQ
1. Q: What's the advantage of the three matrix configurations?
A: The switchable 4×32, 8×16, and dual 4×16 topologies provide exceptional flexibility, allowing the same module to handle both high-fanout test scenarios and parallel multi-DUT testing without hardware changes.
2. Q: In what way does relay counting function help my test system?
A:A built-in relay usage counter allows-a predictive maintenance by tracking relay cycles, thus enabling replacement of modules before failure and reduction of downtime caused by unexpected event in automated test equipment.
3. Q: Which applications need 10MHz bandwidth?
A:Such bandwidth covers audio testing, digital bus switching, and medium frequency signal routing areas where through the matrix signal integrity must be maintained without considerable attenuation or crosstalk.
4. Q: What is the reason for using latching relays in this matrix module?
A:Latching relays only use power during switching, which is one of the reasons-in high-density systems that highly concern/power dissipation and thermal management, especially in multi-module chassis.
5. Q: What feature of the 100-pin front connector aids the system integration?
A:All 128 cross-points are connected through one single high-density connector which provides-clean signal routing, thus reducing cabling complexity and ensuring connections are reliable while at the same time minimizing setup time in rack systems.
