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                                                                  Products

                                                                  PXI Instrumentation
                                                                  PXI Multiplexer Switch ModulePXI Matrix Switch ModulePXI Relay ModulePXI Programmable Resistor Module
                                                                  Sensor
                                                                  MEMS Accelerometer SensorMEMS Vibration SensorMEMS Shock SensorMEMS Pressure SensorMEMS Inclinometer SensorForce Sensor
                                                                  Connector
                                                                  Mass InterconnectPXI Board ConnectorMicro ConnectorRectangular ConnectorCircular Connector

                                                                  Featured products

                                                                  • MEMS Column Type Bidirectional Tension Compression Force Sensor

                                                                    MEMS Column Type Bidirectional Tension Compression Force Sensor

                                                                    • Accuracy: < 0.1% F.S. • Excitation Voltage: 5 - 15 V DC • Full-Scale Deflection: < 0.3 mm • Selectable Range: 0.1 - 20 kN • Technology: Silicon Piezoresistive • Housing: Stainless Steel

                                                                  • MEMS Three Axis Vibration Sensor With American Standard

                                                                    MEMS Three Axis Vibration Sensor With American Standard

                                                                    - 304 stainless steel monolithic housing - Amplitude-frequency response up to 10,000 Hz - 10,000g shock resistance on any axis - Selectable measurement range: ±50g to ±500g - MEMS variable capacitance technology - Lightweight: ​‍​‌‍​‍‌​‍​‌‍​‍‌15g

                                                                  • MEMS High Precision Pressure Sensor

                                                                    MEMS High Precision Pressure Sensor

                                                                    Accuracy:‍‌‍‍‌‍‌‍‍‌ ±0.02% span over the temperature range Response Time: 300 milliseconds or less Long-term Stability: ±100 ppm FS/year Measurement Range: 0-20 MPa (selectable) Sensing Technology: Silicon resonant sensor Overpressure Tolerance: 1.5 times the full-scale pressure

                                                                  Board Card Assembly

                                                                  • 68 Pin Modular Wire Harness Board Card Assembly

                                                                    68 Pin Modular Wire Harness Board Card Assembly

                                                                    TFC​‍​‌‍​‍‌​‍​‌‍​‍‌ offers excellent PXI-compatible cable assemblies which can be used for ICA/ Qua/ TRI/ coaxial modules. The wiring harness assembly can be customized to anyone's requirement. The options include 68-pin connectors such as VHDCI68 and SCSI68, as well as SMB connectors that are suitable for digital /RF mixed-signal test systems. Such a board card assembly has become the standard modular components at TFC. Cable assembly specifications: Operating voltage 30V, standard length 0.5m, contacts are gold-plated (copper/beryllium copper), low resistance (≤35mΩ/≤25mΩ), "mass interconnection" ​‍​‌‍​‍‌​‍​‌‍​‍‌​‍​‌‍​‍‌​‍​‌‍​‍‌type.

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                                                                    TengFang Technology Co., Ltd.

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                                                                    Building A38, Liandong U Valley, Baishazhou, Wangcheng Economic and Technological Development Zone, Changsha City, Hunan Province, China

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