• Accuracy: < 0.1% F.S. • Excitation Voltage: 5 - 15 V DC • Full-Scale Deflection: < 0.3 mm • Selectable Range: 0.1 - 20 kN • Technology: Silicon Piezoresistive • Housing: Stainless Steel
- 304 stainless steel monolithic housing - Amplitude-frequency response up to 10,000 Hz - 10,000g shock resistance on any axis - Selectable measurement range: ±50g to ±500g - MEMS variable capacitance technology - Lightweight: 15g
Accuracy: ±0.02% span over the temperature range Response Time: 300 milliseconds or less Long-term Stability: ±100 ppm FS/year Measurement Range: 0-20 MPa (selectable) Sensing Technology: Silicon resonant sensor Overpressure Tolerance: 1.5 times the full-scale pressure
Example of high-speed data plug connection solution
Example diagram: 68-pin interface of the board card → Switch to the ICA end of the TPDC high-speed connector → switch to the ITA end of the TPDC high-speed connector → Switch to the cable conditioning box → switch to the equipment under test
Basic parameters
Data rate: 12.5+Gbps per pair of differential lines
Insertion loss: <ldb(0-6.25Ghz)
Crosstalk: -30dB to 6.25GHZ(same group differential pair) -40dB to 6.25GHz(adjacent group differential pair)
Insertion and extraction force: ≤4.4N/ module
Contact resistance: ≤ 30 mΩ
Withstand voltage: ≥ 1050 VDC
Cycle life: > 150,000 insertions and extractions
Contact strength: Insertion force <6.67N, withdrawal force >22.24N
Impedance: Differential pair 100± 10Q(before welding) 100±15Ω(after welding)
Operating current/voltage: Max3A/Max 350V
Insulation resistance: > 1000 MΩ
Operating temperature: -55°C to +125°C
Features of the high-speed series products
1、The insertion and extraction life is over 150,000 times. The arc-shaped design of the front contact points and the elastic structure effectively reduce the insertion force. The insertion force is less than 6.7N, ensuring that the product can be effectively inserted and extracted more than 150,000 times.
2、High-density connection, flat design, space-saving. Taking the CMV series modules as an example, 34 pieces can be installed, with over 68 sets of differential pairs.
3、Multiple groups can be inserted and unplugged side by side for stability. The top of the module is equipped with three concave and convex holes. When multiple groups are used side by side, it can effectively prevent slipping and ensure the consistency of insertion.
4、There are various jumper options available, including a wide range of tail jumper choices: it supports the current mainstream bus protocols, such as USB 3.2 Gen 1DisplayPort,HDMI2.0, SFP+, Cat 7,SATA,e-SATA, Rosenberger HSD, etc
5、The side claw locking ensures the insertion and extraction performance. The wide-side claw design effectively locks and guarantees that the contacts are not worn during the withdrawal process, ensuring the connection performance during long-term insertion and extraction.
6、The product adopts an offset structure design to ensure the integrity of signal transmission. Each chip contains two sets of differential pairs, effectively guaranteeing the integrity of signal transmission. The insertion loss is less than 2db.
With the development of bus technology, high-speed applications have become very widespread, ranging from military drones to commercial multimedia screens, or in the automotive electronics field. The requirement for test speed has also been upgraded from Mbps to Gbps. In the test :1. How to ensure the integrity of the signal; 2. How to jump from Mbps to Gbps; 3. How to ensure the service life of the product. The CMV high-speed series connection solution TPDC launched by Tengfang Zhongke can precisely meet the above three requirements.
The high-speed series modules are compatible with low-speed and ordinary signal connections
The integration of the QUA signal SIM series module enables the installation of low-current, low-speed and high-speed signals on the same module, allowing for the simultaneous carrying and integration of multiple rate signals.
About Us
Tengfang Zhongke is a national high-tech enterprise founded in Changsha in 2015, focusing on one-stop interconnection solutions and adhering to the mission of "Making connections simpler". The company integrates R&D, production, and sales, with an independent and complete R&D system. It has established a professional R&D team, focusing on interconnection technology innovation, and deeply engaged in the R&D of high-density, high-speed, and anti-interference interconnection products. It possesses full-process R&D capabilities from scheme design, prototype development to technical verification, continuously breaks through core technical bottlenecks, and provides solid technical support for customized solutions. Its core products cover massive interconnection products, high-density connectors, PXI cable harnesses, etc. It provides customized cable and interconnection solution services, and has passed ISO9001 quality management system and military qualification certification. Its products are widely used in aerospace, national defense and military industry, automotive electronics, semiconductors and other fields.
FAQ
Question: What is the core connection solution of Tengfang Zhongke's high-speed series and what core demands can it meet?
The core solution is TPDC, which can meet the three major demands in high-speed testing: ensuring signal integrity,
jumping test speed from Mbps to Gbps, and extending product service life.
Question: What are the maximum slots and number of signal points of the high-speed signal module?
Answer: Some high-speed signal modules (such as CMV08243 and CMV08143) have 34 slots and 272 signal
points.
